The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 21, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, JP;

Inventors:

Takayuki Kiwanami, Nagano, JP;

Junji Sato, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/485 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49894 (2013.01); H01L 23/485 (2013.01); H01L 23/49822 (2013.01); H01L 23/13 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer.


Find Patent Forward Citations

Loading…