The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Sep. 02, 2010
Takuya Kadoguchi, Toyota, JP;
Yoshikazu Suzuki, Toyota, JP;
Masaya Kaji, Toyota, JP;
Kiyofumi Nakajima, Chigasaki, JP;
Tatsuya Miyoshi, Nagoya, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
Takuya Kadoguchi, Toyota, JP;
Yoshikazu Suzuki, Toyota, JP;
Masaya Kaji, Toyota, JP;
Kiyofumi Nakajima, Chigasaki, JP;
Tatsuya Miyoshi, Nagoya, JP;
Takanori Kawashima, Anjo, JP;
Tomomi Okumura, Toyota, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-Shi, JP;
Abstract
A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.