The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Dec. 12, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Min-sung Song, Hwaseong-si, KR;

Jin-hyun Shin, Suwon-si, KR;

Jae-hwang Sim, Hwaseong-si, KR;

Joon-sung Lim, Yongin-si, KR;

Bong-hyun Choi, Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/768 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); H01L 21/3081 (2013.01); H01L 21/3088 (2013.01); H01L 21/768 (2013.01); H01L 21/0334 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01);
Abstract

In a method of manufacturing a semiconductor device, which uses a triple patterning process, a porous layer covering sidewalls and an upper surface of a polymer-containing pattern is formed on a layer to be etched. A decomposition gas is supplied to the polymer-containing pattern through the porous layer, and a portion of the polymer-containing pattern is decomposed to form a reduced polymer-containing pattern and form a void between the reduced polymer-containing pattern and the porous layer. A portion of the porous layer is removed to form a porous spacer pattern spaced apart from the reduced polymer-containing pattern. The layer to be etched is etched by using the reduced polymer-containing pattern and the porous spacer pattern as an etch mask.


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