logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9330827 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Feb. 14, 2011

Method of manufacturing inductors for integrated circuit packages

Applicants:

Donald Gardner, Mountain View, CA (US);

Gerhard Schrom, Hillsboro, OR (US);

Fabrice Paillet, Hillsboro, OR (US);

Shamala Chickamenahalli, Chandler, AZ (US);

Inventors:

Donald Gardner, Mountain View, CA (US);

Gerhard Schrom, Hillsboro, OR (US);

Fabrice Paillet, Hillsboro, OR (US);

Shamala Chickamenahalli, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Trop Pruner & Hu, P.C.

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 17/02 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0033 (2013.01); H01F 17/0006 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 17/02 (2013.01); H01F 27/2804 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0053 (2013.01); H01F 2017/0066 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49147 (2015.01);
Abstract

A process of making inductors for integrated circuit packages may involve forming an inductor upon a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.

Find Patent Forward Citations

Gardner, Donald. (2016). Method of manufacturing inductors for integrated circuit packages (U.S. Patent No. 9330827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9330827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…