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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9327364 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Jan. 15, 2015

Solder piece, chip solder and method of fabricating solder piece

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Masahiko Abe, Tochigi, JP;

Koji Watanabe, Tochigi, JP;

Hideaki Takahashi, Tochigi, JP;

Masahiko Kanno, Tochigi, JP;

Masaya Ito, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

Chernoff, Vilhauer, McClung & Stenzel, LLP

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/14 (2006.01); B23K 35/30 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); B23K 35/32 (2006.01); B23K 35/40 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01); B26F 1/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0222 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 35/02 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/286 (2013.01); B23K 35/302 (2013.01); B23K 35/325 (2013.01); B23K 35/40 (2013.01); B26F 1/02 (2013.01); H05K 3/3478 (2013.01); B23K 2201/42 (2013.01); H05K 3/3484 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10992 (2013.01); H05K 2203/0415 (2013.01); H05K 2203/082 (2013.01); Y02P 70/611 (2015.11); Y10T 83/0448 (2015.04); Y10T 83/0481 (2015.04);
Abstract

A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.

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