The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Mar. 16, 2015
Applicant:

Toshiba Corporation, Minato-ku, Tokyo, JP;

Inventors:

Chao-Kun Lin, San Jose, CA (US);

Norihito Hamaguchi, Morgan Hill, CA (US);

Assignee:

Toshiba Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/24 (2006.01); H01L 31/0203 (2014.01); H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 29/861 (2013.01); H01L 33/0095 (2013.01); H01L 33/483 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure provides a novel light-emitting diode package and corresponding fabrication method for making such a package. The novel LED package comprises a resin carrier layer having a first and second surface. Embedded in the resin carrier layer are at least one electrical conductor and at least one LED. The embedded LED comprises a substrate having a bottom surface that is substantially exposed at the second surface of the resin carrier layer. The embedded LED further comprises a light emitting layer that is substantially exposed at the first surface of the resin carrier layer.


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