The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Jan. 30, 2012
Applicants:
Brent Keeth, Boise, ID (US);
Mark Hiatt, Eagle, ID (US);
Terry R. Lee, Boise, ID (US);
Mark Tuttle, Meridian, ID (US);
Rahul Advani, Boise, ID (US);
John F. Schreck, Lucas, TX (US);
Inventors:
Brent Keeth, Boise, ID (US);
Mark Hiatt, Eagle, ID (US);
Terry R. Lee, Boise, ID (US);
Mark Tuttle, Meridian, ID (US);
Rahul Advani, Boise, ID (US);
John F. Schreck, Lucas, TX (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H01L 25/065 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/50 (2013.01); H01L 23/5385 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/15311 (2013.01); Y10T 29/49165 (2015.01);
Abstract
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.