The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Sep. 19, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Kabirkumar Mirpuri, Scottsdale, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01L 23/00 (2006.01); B23K 1/20 (2006.01); H01L 25/10 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/20 (2013.01); H01L 25/105 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/351 (2013.01); H05K 3/3436 (2013.01);
Abstract
An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.