The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Oct. 29, 2012
Applicant:

Amkor Technology, Inc., Chandler, AZ (US);

Inventors:

Ronald Patrick Huemoeller, Gilbert, AZ (US);

Frederick Evans Reed, Raleigh, NC (US);

David Jon Hiner, Chandler, AZ (US);

Kiwook Lee, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H05K 3/42 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H05K 3/4038 (2013.01); H05K 3/42 (2013.01); Y10T 29/49165 (2015.01); Y10T 29/49204 (2015.01);
Abstract

A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.


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