The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jul. 31, 2015
Applicant:

Avogy, Inc., San Jose, CA (US);

Inventors:

Patrick James Lazlo Hyland, San Jose, CA (US);

Brian Joel Alvarez, San Jose, CA (US);

Donald R. Disney, Cupertino, CA (US);

Assignee:

Avogy, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/283 (2006.01); H01L 23/528 (2006.01); H01L 29/20 (2006.01); H01L 23/532 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 23/495 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7685 (2013.01); H01L 21/283 (2013.01); H01L 21/28575 (2013.01); H01L 21/76865 (2013.01); H01L 23/4827 (2013.01); H01L 23/49513 (2013.01); H01L 23/528 (2013.01); H01L 23/53204 (2013.01); H01L 24/05 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 29/2003 (2013.01); H01L 29/417 (2013.01); H01L 29/41741 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/9221 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/92242 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A method for fabricating a vertical gallium nitride (GaN) power device can include providing a GaN substrate with a top surface and a bottom surface, forming a device layer coupled to the top surface of the GaN substrate, and forming a metal contact on a top surface of the vertical GaN power device. The method can further include forming a backside metal by forming an adhesion layer coupled to the bottom surface of the GaN substrate, forming a diffusion barrier coupled to the adhesion layer, and forming a protection layer coupled to the diffusion barrier. The vertical GaN power device can be configured to conduct electricity between the metal contact and the backside metal.


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