The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Apr. 29, 2011
Applicants:

Shinichi Kurita, San Jose, CA (US);

Jozef Kudela, San Jose, CA (US);

Suhail Anwar, San Jose, CA (US);

John M. White, Hayward, CA (US);

Dong-kil Yim, Sungnam, KR;

Hans Georg Wolf, Erlensee, DE;

Dennis Zvalo, Santa Clara, CA (US);

Makoto Inagawa, Palo Alto, CA (US);

Ikuo Mori, San Jose, CA (US);

Inventors:

Shinichi Kurita, San Jose, CA (US);

Jozef Kudela, San Jose, CA (US);

Suhail Anwar, San Jose, CA (US);

John M. White, Hayward, CA (US);

Dong-Kil Yim, Sungnam, KR;

Hans Georg Wolf, Erlensee, DE;

Dennis Zvalo, Santa Clara, CA (US);

Makoto Inagawa, Palo Alto, CA (US);

Ikuo Mori, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/511 (2006.01); C23C 16/54 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67712 (2013.01); C23C 16/4587 (2013.01); C23C 16/46 (2013.01); C23C 16/463 (2013.01); C23C 16/511 (2013.01); C23C 16/54 (2013.01); H01J 37/3222 (2013.01); H01J 37/32192 (2013.01); H01L 21/6719 (2013.01); H01L 21/67126 (2013.01); H01L 21/67173 (2013.01); H01L 21/67201 (2013.01);
Abstract

The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.


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