The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jan. 11, 2013
Applicants:

Kazunari Nakata, Tokyo, JP;

Yoshiaki Terasaki, Tokyo, JP;

Inventors:

Kazunari Nakata, Tokyo, JP;

Yoshiaki Terasaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/67115 (2013.01); H01L 21/67132 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A wafer is mounted to a dicing frame using a holding tape. A plurality of semiconductor devices are provided on a center portion of a major surface of the wafer. A ring-like reinforcing section is provided on a periphery of the major surface. The holding tape is adhered to the major surface The holding tape is heated to at least 0.6 times of melting temperature of the holding tape so as to adhere the holding tape along a step of the ring-like reinforcing section.


Find Patent Forward Citations

Nakata, Kazunari. (2016). Method for manufacturing semiconductor device (U.S. Patent No. 9324581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9324581

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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