The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Dec. 04, 2013
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B31F 1/07 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0015 (2013.01);
Abstract
A method for microcontact embossing of a structure by transferring an embossing material onto a target surface of a substrate by means of an embossing surface of a structural die. The embossing material is comprised at least predominantly of silane or at least predominantly of at least one silane derivative and in that the structural die is a soft die. A corresponding method is provided in which the embossing material is a molecular component that is comprised at least predominantly of organic molecules.