The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jul. 31, 2014
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Zhiqiang Niu, Santa Clara, CA (US);

Jun Lu, San Jose, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Hongtao Gao, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 21/78 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01);
Abstract

The present invention discloses the MCSP power semiconductor device and the preparation method thereof. In the present invention method, a metal foil layer is attached to the back of the wafer using a conductive adhesive layer and a composite tape is laminated on the metal foil layer. Thus, individual MCSP power semiconductor devices are separated by cutting the wafer, the conductive adhesive, the metal foil layer and the composite tape along the scribe lines between adjacent semiconductor chips formed on the front of the wafer.


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