The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Apr. 15, 2015
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Masahiro Sunohara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Abstract
A wiring substrate includes a substrate body, a through hole extending through the substrate body from an upper surface to a lower surface of the substrate body, and a through electrode formed in the through hole. The through electrode includes a conductive layer that forms a cavity in the through hole, and a resin layer that fills the cavity. The conductive layer includes first to third metal layers. The first metal layer is formed on an upper wall surface of the through hole. The second metal layer covers at least a portion of the first metal layer and an upper opening of the through hole. The third metal layer is formed on a lower wall surface of the through hole and connected to at least the first metal layer or the second metal layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile