The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Mar. 24, 2011
Applicants:

Naoki Taya, Tokyo, JP;

Takashi Morioka, Tokyo, JP;

Inventors:

Naoki Taya, Tokyo, JP;

Takashi Morioka, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); C09J 7/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0267 (2013.01); C09J 7/0296 (2013.01); H01L 21/6836 (2013.01); C09J 2201/162 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2423/046 (2013.01); C09J 2433/006 (2013.01); C09J 2463/006 (2013.01); Y10T 428/287 (2015.01); Y10T 428/2848 (2015.01);
Abstract

A base material film used for a dicing sheet, the dicing sheet including the base material film and a pressure-sensitive adhesive layer laminated on one surface of the base material film. The base material film includes a single layer of resin film or multiple layers of resin films, at least the resin film in contact with the pressure-sensitive adhesive layer being formed from a resin composition containing ethylene-(meth)acrylic acid copolymer as a main constituent, the resin composition further containing 0.3 to 17.0 parts by mass of an epoxy compound based on 100 parts by mass of the ethylene-(meth)acrylic acid copolymer. The dicing sheet that uses the base material film does not require application of physical energy such as an electron beam or a γ-ray, and can be reduced in dicing dust that is generated during the dicing of a cut object.


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