The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Nov. 05, 2013
Applicant:

Asustek Computer Inc., Taipei, TW;

Inventors:

Chia-Ching Niu, Taipei, TW;

Ing-Jer Chiou, Taipei, TW;

Cheng-Yu Wang, Taipei, TW;

Assignee:

ASUSTEK COMPANY INC., Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02B 1/00 (2006.01); H02B 1/56 (2006.01); H05K 7/20 (2006.01); H05K 1/00 (2006.01); H01R 13/46 (2006.01); H05K 5/00 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01); G06F 1/20 (2006.01); F28D 15/02 (2006.01); F04D 29/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H05K 7/20145 (2013.01); H05K 7/20445 (2013.01); F04D 29/40 (2013.01); F28D 15/02 (2013.01);
Abstract

An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Published as:
US2014146472A1; CN103841802A; US9313915B2; CN103841802B;

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