The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Apr. 02, 2010
Kwang Choon Chung, Yongin-si, KR;
Young-koo Han, Bucheon-si, KR;
Myung-bong Yoo, Yongin-si, KR;
Nam-boo Cho, Anyang-si, KR;
Young-ho Han, Bucheon-si, KR;
Kyong-min Lee, Anyang-si, KR;
Kwang-baek Yoon, Siheung-si, KR;
Hee-yong Ahn, Gunpo-si, KR;
Su-han Kim, Ansan-si, KR;
Kwang Choon Chung, Yongin-si, KR;
Young-Koo Han, Bucheon-si, KR;
Myung-Bong Yoo, Yongin-si, KR;
Nam-Boo Cho, Anyang-si, KR;
Young-Ho Han, Bucheon-si, KR;
Kyong-Min Lee, Anyang-si, KR;
Kwang-Baek Yoon, Siheung-si, KR;
Hee-Yong Ahn, Gunpo-si, KR;
Su-Han Kim, Ansan-si, KR;
Inktec Co., Ltd., Ansan-si, KR;
Haeun Chemtec Co., Ltd., Ansan-si, KR;
Abstract
Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.