The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Sep. 14, 2012
Applicants:

Joachim Mahler, Regensburg, DE;

Manfred Mengel, Bad Abbach, DE;

Khalil Hosseini, Weihmichl, DE;

Franz-peter Kalz, Regensburg, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Manfred Mengel, Bad Abbach, DE;

Khalil Hosseini, Weihmichl, DE;

Franz-Peter Kalz, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/28 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 21/56 (2013.01); H01L 23/49586 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 23/3107 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37139 (2013.01); H01L 2224/37144 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/8492 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H05K 2203/135 (2013.01); Y10T 29/49144 (2015.01);
Abstract

A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.


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