The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Feb. 03, 2014
Applicant:

Lingsen Precision Industries, Ltd., Taichung, TW;

Inventors:

Ming-Te Tu, Taichung, TW;

Yao-Ting Yeh, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 31/173 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 31/173 (2013.01); H01L 31/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); Y02P 70/521 (2015.11);
Abstract

A micro optical package structure with filtration layers includes a substrate having a light-emitting area and a light-receiving area, a light-emitting chip being deposited in a light-emitting area, a light-receiving chip being deposited in a light-receiving area, two packaging resin bodies for enclosing the light-emitting chip and the light-receiving chip, respectively, and being separately deposited in the light-emitting area and the light-receiving area, respectively, and the filtration layers formed on the packaging resin bodies surface for filtering out lights of different wavelengths. The micro optical package structure needs neither barrier nor protective cover between or outside the packaging resin bodies, so can be microminiaturized. The micro optical package structure can filter out visible lights of specific wavelengths without using any additional filters.


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