The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Feb. 28, 2013
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Nisshin, JP;
Akira Mochida, Nagoya, JP;
Tomomi Okumura, Chiryu, JP;
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Nisshin, JP;
Akira Mochida, Nagoya, JP;
Tomomi Okumura, Chiryu, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
The present invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device has a plurality of power units placed in parallel in a predetermined direction, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other. The semiconductor elements of each of the two power units include a near-sided semiconductor element that is closer to an inlet of the resin among the two semiconductor elements having the predetermined gap therebetween. A structure is positioned on a passage and downstream in a resin flow direction relative to a predetermined position that corresponds to end parts of the near-sided semiconductor elements. The structure is a joint to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit.