The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Jun. 25, 2015
Asm Technology Singapore Pte Ltd, Singapore, SG;
Karel Maykel Richard Van Der Stam, Apeldoorn, NL;
Guido Martinus Henricus Knippels, Schijndel, NL;
Mark Christian Mueller, Bietigheim-Bissingen, DE;
Juergen Roland Betz, Bad Kreuznach, DE;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.