The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Jul. 13, 2012
Applicants:

Masaru Tanaka, Yokosuka, JP;

Masashi Kuriyama, Yokosuka, JP;

Hiroki Murooka, Ehime, JP;

Inventors:

Masaru Tanaka, Yokosuka, JP;

Masashi Kuriyama, Yokosuka, JP;

Hiroki Murooka, Ehime, JP;

Assignees:

SUMITOMO HEAVY INDUSTRIES, LTD., Shinagawa-Ku, Tokyo, JP;

SEN CORPORATION, Shinagawa-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68764 (2013.01); H01J 37/32871 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 2237/02 (2013.01); H01J 2237/0203 (2013.01); Y10T 29/49 (2015.01);
Abstract

An electrostatic chuck protection method includes providing an exposed chuck surface with a protective surface for preventing adherence of foreign materials including a substance exhibiting volatility in a vacuum environment, and removing the protective surface in order to perform a process of forming a substrate electrostatically held on the chuck surface with a surface layer including a substance having volatility in a vacuum chamber. The protective surface may be provided when a low vacuum pumping mode of operation is performed in a vacuum environment surrounding the chuck surface.


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