The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Nov. 01, 2012
Lintec Corporation, Tokyo, JP;
LINTEC Corporation, Tokyo, JP;
Abstract
A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 μm. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G' at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 μm and a diameter of 15 μm at a pitch of 40 μm having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 μm or less of the electrode.