The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Dec. 20, 2010
Applicants:
Markus Wimplinger, Ried im Innkreis, AT;
Thomas Wagenleitner, Aurolzmünster, AT;
Alexander Filbert, St. Florian am Inn, AT;
Inventors:
Markus Wimplinger, Ried im Innkreis, AT;
Thomas Wagenleitner, Aurolzmünster, AT;
Alexander Filbert, St. Florian am Inn, AT;
Assignee:
EV Group E. Thallner GmbH, , AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); H01L 21/67288 (2013.01); H01L 21/683 (2013.01); H01L 21/67092 (2013.01); H01L 22/12 (2013.01);
Abstract
A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on the mounting surface. A compensation means is provided for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.