The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Aug. 29, 2014
Siltronic Ag, Munich, DE;
Juergen Schwandner, Garching, DE (US);
SILTRONIC AG, Munich, DE;
Abstract
A method of simultaneous double-side polishing of at least one semiconductor material wafer includes disposing each wafer in a respective suitably dimensioned cutout in a carrier plate having a front and rear side. The at least one wafer is polished between an upper polishing plate covered with a first polishing pad and a lower polishing plate covered with a second polishing pad while supplying a polishing agent. The polishing agent is supplied on the front and rear side of the wafer through openings in the upper and lower polishing pads and the upper and lower polishing plates. Each polishing pad has an inner circular region and outer ring shaped region where the quantity of polishing agent emerging from openings in the working gap per unit time in the inner circular region of the polishing pad is different from the quantity that emerges from openings in the outer ring-shaped region.