The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Jul. 10, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H05K 1/186 (2013.01); H05K 3/30 (2013.01); H05K 3/4697 (2013.01); H05K 1/0233 (2013.01); H05K 3/0032 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0209 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.