The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Aug. 25, 2014
Applicants:

David Howard Levy, Rochester, NY (US);

Theodore Zubil, Honeoye Falls, NY (US);

Richard W. Topel, Jr., Rochester, NY (US);

Wendy G. Ahearn, Rochester, NY (US);

Inventors:

David Howard Levy, Rochester, NY (US);

Theodore Zubil, Honeoye Falls, NY (US);

Richard W. Topel, Jr., Rochester, NY (US);

Wendy G. Ahearn, Rochester, NY (US);

Assignee:

Natcore Technology, Inc., Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0236 (2006.01); H01L 31/18 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H01L 31/0224 (2006.01); H01L 31/068 (2012.01);
U.S. Cl.
CPC ...
H01L 31/02363 (2013.01); H01L 21/02019 (2013.01); H01L 21/30604 (2013.01); H01L 21/32134 (2013.01); H01L 21/6704 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 31/0236 (2013.01); H01L 31/022425 (2013.01); H01L 31/068 (2013.01); H01L 31/1804 (2013.01); Y02P 70/521 (2015.11);
Abstract

Systems and methods for etching the surface of a substrate may utilize a thin layer of fluid to etch a substrate for improved anti-reflective properties. The substrate may be secured with a holding fixture that is capable of positioning the substrate. A fluid comprising an acid and an oxidizer for etching may be prepared, which may optionally include a metal catalyst. An amount of fluid necessary to form a thin layer contacting the surface of the substrate to be etched may be dispensed. The fluid may be spread into the thin layer utilizing a tray that the substrate is dipped into, a plate that is placed near the surface of the substrate to be etched, or a spray or coating device.


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