The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Dec. 30, 2014
Globalfoundries, Inc., Grand Cayman, KY;
Azat Latypov, San Jose, CA (US);
Ji Xu, San Jose, CA (US);
GLOBALFOUNDRIES, INC., Grand Cayman, KY;
Abstract
Methods for fabricating integrated circuits using directed self-assembly to form via and contact holes are disclosed. An exemplary method includes determining a natural, hexagonal separation distance Lbetween cylinders formed in a block copolymer (BCP) material during directed self-assembly (DSA) and determining an integrated circuit feature pitch Paccording to the following formula: P=L*(sqrt(3)/2)*n, wherein n is a positive integer. The method further includes generating an integrated circuit layout design better accommodating the natural formation arrangement of polymeric cylinders, wherein integrated circuit features are spaced in accordance with the integrated circuit feature pitch Pand wherein via or contact structures are physically and electrically connected to the integrated circuit features and fabricating the integrated circuit features and the via or contact structures on a semiconductor work-in-process (WIP) in accordance with the integrated circuit layout design, wherein the via or contact structures are fabricated utilizing DSA with BCP material.