The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Mar. 19, 2014
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-Shi, Kanagawa-Ken, JP;

Inventors:

Taiga Muraoka, Kanagawa, JP;

Motomu Kurata, Kanagawa, JP;

Shinya Sasagawa, Kanagawa, JP;

Katsuaki Tochibayashi, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02554 (2013.01); H01L 21/0212 (2013.01); H01L 21/02274 (2013.01); H01L 21/02381 (2013.01); H01L 21/02488 (2013.01); H01L 21/02565 (2013.01); H01L 21/02667 (2013.01); H01L 21/0337 (2013.01); H01L 21/31138 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01);
Abstract

A stable and minute processing method of a thin film is provided. Further, a miniaturized semiconductor device is provided. A method for processing a thin film includes the following steps: forming a film to be processed over a formation surface; forming an organic coating film over the film to be processed; forming a resist film over the organic coating film; exposing the resist film to light or an electron beam; removing part of the resist film by development to expose part of the organic coating film; depositing an organic material layer on the top surface and a side surface of the resist film by plasma treatment; etching part of the organic coating film using the resist film and the organic material layer as masks to expose part of the film to be processed; and etching part of the film to be processed using the resist film and the organic material layer as masks.


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