The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Jul. 16, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hiroyuki Shinozaki, Tokyo, JP;

Takahiro Shimano, Tokyo, JP;

Akira Imamura, Tokyo, JP;

Akira Nakamura, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/02 (2006.01); B24B 49/18 (2006.01); B24B 37/04 (2012.01); B24B 53/08 (2006.01); B24B 37/005 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); B24B 37/005 (2013.01); B24B 49/02 (2013.01); B24B 49/18 (2013.01); B24B 53/017 (2013.01); B24B 53/08 (2013.01);
Abstract

A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.


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