The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Apr. 18, 2014
Applicants:
Mitsubishi Gas Chemical Company, Inc., Chiyoda-ku, JP;
Ryoko Chemical Co., Ltd., Chiyoda-ku, JP;
Inventors:
Tomoko Suzuki, Tokyo, JP;
Norihumi Tashiro, Kanagawa, JP;
Yukihide Naito, Kanagawa, JP;
Akari Hitotsugo, Kanagawa, JP;
Assignees:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Chiyoda-Ku, JP;
RYOKO CHEMICAL CO., LTD., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2006.01); H05K 3/10 (2006.01); C23F 1/18 (2006.01); C23F 1/02 (2006.01); C23F 1/00 (2006.01); C23G 1/10 (2006.01); C23C 22/52 (2006.01); C23C 18/16 (2006.01); C09K 13/04 (2006.01); H01L 21/3213 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); C09K 13/04 (2013.01); C23C 18/1653 (2013.01); C23C 22/52 (2013.01); C23F 1/00 (2013.01); C23F 1/02 (2013.01); C23F 1/18 (2013.01); C23G 1/103 (2013.01); H01L 21/32134 (2013.01); H05K 3/067 (2013.01); H05K 3/383 (2013.01);
Abstract
A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process:
Suzuki, Tomoko. (2016). Method of treating wiring substrate and wiring substrate manufactured by the same (U.S. Patent No. 9301399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9301399
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile