The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 28, 2014
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Po-Cheng Huang, Kaohsiung, TW;

Yu-Ting Li, Chiayi, TW;

Chih-Hsun Lin, Pingtung County, TW;

Kun-Ju Li, Tainan, TW;

Wu-Sian Sie, Tainan, TW;

Yi-Liang Liu, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/02227 (2013.01); H01L 21/02318 (2013.01); H01L 21/02348 (2013.01); H01L 21/31053 (2013.01); H01L 21/31111 (2013.01); H01L 21/6835 (2013.01); H01L 21/762 (2013.01); H01L 21/76251 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for repairing an oxide layer and a method for manufacturing a semiconductor structure applying the same are provided. The method for repairing an oxide layer comprises following steps. First, a carrier having a first area and a second area is provided, wherein a repairing oxide layer is formed on the second area. Then, the carrier is attached to a substrate with an oxide layer to be repaired formed thereon, wherein the carrier and the substrate are attached to each other through the repairing oxide layer and the oxide layer to be repaired. Thereafter, the oxide layer to be repaired is bonded with the repairing oxide layer.


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