The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9299588 B1

Date of Patent:

Mar. 29, 2016

Filed:

Feb. 18, 2014

Method of manufacturing lead frame

Applicant:

Haesung Ds Co., Ltd., Changwon-Si, KR;

Inventor:

Jeung-Il Kim, Changwon-si, KR;

Assignee:

HAESUNG DS CO., LTD, Changwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Errol Fernandes

Int. Cl.

CPC ...

H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);

U.S. Cl.

CPC ...

H01L 21/4842 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48247 (2013.01);

Abstract

There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.

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