The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Feb. 19, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ning Li, San Jose, CA (US);

Wenbo Yan, Sunnyvale, CA (US);

Victor Nguyen, Novato, CA (US);

Cong Trinh, Santa Clara, CA (US);

Mihaela Balseanu, Cupertino, CA (US);

Li-Qun Xia, Cupertino, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C23C 16/455 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45534 (2013.01); H01L 21/3065 (2013.01);
Abstract

Embodiments disclosed herein generally relate to the processing of substrates, and more particularly, relate to methods for accurate control of film thickness using deposition-etch cycles. Particularly, embodiments of the present disclosure may be used in controlling film thickness during filling high aspect ratio features.


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