The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Aug. 02, 2013
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); C09J 7/02 (2006.01); C09J 163/00 (2006.01); C08F 220/18 (2006.01); C08G 18/75 (2006.01); C08G 18/80 (2006.01); C08G 18/10 (2006.01); C09J 133/06 (2006.01); C09J 175/16 (2006.01); C09J 133/14 (2006.01); C09J 133/00 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0235 (2013.01); C08F 220/18 (2013.01); C08G 18/10 (2013.01); C08G 18/755 (2013.01); C08G 18/8029 (2013.01); C09J 7/0239 (2013.01); C09J 133/00 (2013.01); C09J 133/068 (2013.01); C09J 133/14 (2013.01); C09J 163/00 (2013.01); C09J 175/16 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 21/6836 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 2221/68336 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/9212 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/069 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12044 (2013.01); Y10T 428/1405 (2015.01);
Abstract
A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.