The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Apr. 11, 2011
Applicants:

Jürgen Burggraf, Schärding, AT;

Daniel Burgstaller, Neuhofen im Innkreis, AT;

Inventors:

Jürgen Burggraf, Schärding, AT;

Daniel Burgstaller, Neuhofen im Innkreis, AT;

Assignee:

EV Group E. Thallner GmbH, St. Florian am Inn, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); H01L 21/68707 (2013.01); H01L 21/68721 (2013.01); H01L 21/68785 (2013.01); B32B 38/10 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1978 (2015.01);
Abstract

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.


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