The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 19, 2012
Applicants:

Jimin Zhang, San Jose, CA (US);

Zhihong Wang, Santa Clara, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Wen-chiang Tu, Mountain View, CA (US);

Inventors:

Jimin Zhang, San Jose, CA (US);

Zhihong Wang, Santa Clara, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Wen-Chiang Tu, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/105 (2013.01); B24B 49/12 (2013.01);
Abstract

A method of controlling polishing includes storing a sequence of default values, polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, generating a sequence of measured values from measurements from the in-situ monitoring system, combining the sequence of measured values with the sequence of default values to generate a sequence of modified values, fitting a function to the sequence of modified values, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.


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