The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 26, 2013
Applicant:

Bystronic Laser Ag, Niederoenz, CH;

Inventors:

Daniel Cathry, Roethenbach bei Herzogenbuchsee, CH;

Beat Beutler, Oberoenz, CH;

Sven Rauschenbach, Lotzwil, CH;

Assignee:

Bystronic Laser AG, Niederoenz, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/04 (2014.01); B23K 26/38 (2014.01); B23K 26/14 (2014.01);
U.S. Cl.
CPC ...
B23K 26/041 (2013.01); B23K 26/04 (2013.01); B23K 26/042 (2015.10); B23K 26/043 (2013.01); B23K 26/38 (2013.01); B23K 26/14 (2013.01);
Abstract

Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular COlaser), including at least one laser processing head (), having interior () and nozzle () with nozzle orifice () for allowing a primary beam (), in particular a focused laser working beam, to pass through and onto a work piece () and to align a gas current enveloping the beam, and an alignment device () with several sensors () for centering the primary beam (), in particular a focused laser working beam, and the nozzle orifice () relative to each other. At least one conversion unit (), in particular a conversion edge, is provided in the area of the nozzle orifice () for converting the primary beam () contacting it or impacting on it into one or more secondary electromagnetic heat beams () along at least one propagation direction (A) in direction of the sensors (). The sensors () are configured as radiation sensors and arranged in the interior () of the laser processing head () or the nozzle ().


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