The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Nov. 12, 2013
Applicant:

Acm Research (Shanghai) Inc., Shangahi, CN;

Inventors:

Yue Ma, Shanghai, CN;

David Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 3/46 (2006.01); C23C 16/02 (2006.01); C23C 14/02 (2006.01); C25D 5/02 (2006.01); H01L 21/288 (2006.01); C25D 5/54 (2006.01); H01L 21/768 (2006.01); C23C 14/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4661 (2013.01); C23C 14/021 (2013.01); C23C 16/0227 (2013.01); C25D 5/02 (2013.01); C25D 5/54 (2013.01); H01L 21/2885 (2013.01); H01L 21/76877 (2013.01); H05K 3/4644 (2013.01); C23C 14/024 (2013.01); C23C 14/046 (2013.01); C23C 16/0272 (2013.01);
Abstract

The present invention improves the wetting between process solution and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface. The pre-implementing adsorbed liquid is fully filled in the patterned structures formed on the wafer by multilayer absorption of the vaporized liquid molecules and the temperature of the wafer surface is above dew point of the vaporized liquid while condensing, which avoids generating bubbles inside the patterned structures.


Find Patent Forward Citations

Loading…