The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Sep. 05, 2012
Applicants:

Hiromichi Gohara, Matsumoto, JP;

Akira Morozumi, Okaya, JP;

Takeshi Ichimura, Matsumoto, JP;

Inventors:

Hiromichi Gohara, Matsumoto, JP;

Akira Morozumi, Okaya, JP;

Takeshi Ichimura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01); F28F 3/12 (2006.01); F28F 9/02 (2006.01); F28F 3/02 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); F28F 3/02 (2013.01); F28F 3/12 (2013.01); F28F 9/026 (2013.01); H01L 23/3735 (2013.01); H05K 7/20927 (2013.01); H01L 2924/0002 (2013.01); H02M 7/003 (2013.01);
Abstract

A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path.


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