The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Dec. 30, 2013
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Erh-Kun Lai, Taichung, TW;

Guan-Ru Lee, Kaohsiung, TW;

Yen-Hao Shih, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/105 (2006.01); H01L 23/522 (2006.01); H01L 21/3213 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 29/792 (2006.01); H01L 27/115 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32133 (2013.01); H01L 21/32055 (2013.01); H01L 21/76805 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01); H01L 27/11568 (2013.01); H01L 27/11578 (2013.01); H01L 29/4234 (2013.01); H01L 29/66833 (2013.01); H01L 29/792 (2013.01);
Abstract

A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, a stacked structure, a dielectric layer, a conductive structure, a dielectric structure and a conductive plug. The stacked structure includes dielectric films and conductive films arranged alternately. The dielectric layer is between the conductive structure and a sidewall of the stacked structure. The dielectric structure is on the stacked structure and defining a through via. The conductive plug fills the through via and physically contacts one of the conductive films exposed by the through via and adjoined with the dielectric layer.


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