The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Jun. 12, 2013
Applicant:
Sumco Techxiv Corporation, Nagasaki, JP;
Inventor:
Kenji Yamashita, Tokyo, JP;
Assignee:
SUMCO TECHXIV CORPORATION, Nagasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/02 (2006.01); B24B 37/08 (2012.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02024 (2013.01); B24B 9/065 (2013.01); B24B 37/08 (2013.01); H01L 21/02013 (2013.01); H01L 21/02021 (2013.01); H01L 21/0223 (2013.01); H01L 21/02052 (2013.01); H01L 21/02087 (2013.01);
Abstract
A method of manufacturing a semiconductor wafer includes: rough-polishing front and back surfaces of the semiconductor wafer; mirror-polishing a chamfered portion of the rough-polished semiconductor wafer; performing mirror finish polishing on the front surface or both the front and back surfaces of the semiconductor wafer having the mirror-polished chamfered portion; and forming an oxide film on an entire surface of the semiconductor wafer after the mirror-polishing of the chamfered portion and before the mirror finish polishing.