The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

May. 23, 2014
Applicant:

Sumitomo Electric Device Innovations, Inc., Yokohama-shi, Kanagawa, JP;

Inventor:

Tsutomu Komatani, Yokohama, JP;

Assignee:

SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Yokohama-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/3115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0234 (2013.01); H01L 21/0272 (2013.01); H01L 21/0277 (2013.01); H01L 21/02326 (2013.01); H01L 21/02329 (2013.01); H01L 21/02337 (2013.01); H01L 21/3115 (2013.01); H01L 21/31144 (2013.01); H01L 29/205 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01);
Abstract

A semiconductor device includes a semiconductor layer, an insulating film of silicon nitride on the semiconductor layer, source and drain electrodes formed in openings of the insulating film and in contact with the semiconductor layer, and a gate electrode formed in an opening in the insulating film that is located between the source electrode and the drain electrode and formed in contact with the semiconductor layer. The insulating film has an Si content that is uniform in a direction of thickness of the insulating film, an upper region, and a lower region. The upper region can have an oxygen concentration that is greater than that of the lower region. The upper region can be formed by exposing the surface of the insulating film to ozone or an oxygen plasma.


Find Patent Forward Citations

Loading…