The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Jul. 21, 2014
Amkor Technology, Inc., Chandler, AZ (US);
JongSik Paek, Incheon, KR;
JinYoung Kim, Seoul, KR;
YoonJoo Kim, Seoul, KR;
JinHan Kim, Gyeonggi-do, KR;
SeungJae Lee, Gyeonggi-do, KR;
SeWoong Cha, Gyeonggi-do, KR;
SungKyu Kim, Seoul, KR;
JaeHun Bae, Seoul, KR;
DongJin Kim, Gwangju, KR;
DooHyun Park, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.