The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Jun. 27, 2013
Applicant:
Leo M. Higgins, Iii, Austin, TX (US);
Inventor:
Leo M. Higgins, III, Austin, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/49582 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15747 (2013.01);
Abstract
A packaged semiconductor device includes a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; and an encapsulant surrounding the semiconductor die. At least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead includes a thin portion external to the encapsulant and a thick portion that is surrounded by the encapsulant, wherein the thin portion is thinner than the thick portion.
Higgins, III, Leo. (2016). Packaged semiconductor device (U.S. Patent No. 9287200). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9287200
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile