The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Dec. 28, 2012
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Yasuhiko Mano, Ogaki, JP;

Kazuhiro Yoshikawa, Ogaki, JP;

Takashi Kariya, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H05K 1/165 (2013.01); H05K 1/18 (2013.01); H05K 1/185 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01); H05K 1/162 (2013.01); H05K 3/4602 (2013.01); H05K 3/4682 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/1469 (2013.01);
Abstract

A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.


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