The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Mar. 07, 2014
Applicants:
Chin-sheng Wang, Hsinchu County, TW;
Chao-min Wang, Hsinchu County, TW;
Inventors:
Chin-Sheng Wang, Hsinchu County, TW;
Chao-Min Wang, Hsinchu County, TW;
Assignee:
Subtron Technology Co., Ltd., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/58 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 3/0097 (2013.01); H05K 3/188 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/1536 (2013.01);
Abstract
A core substrate includes a dielectric layer, at least one releasing layer, at least one first copper foil layer and at least one nickel layer. The releasing layer is disposed on the dielectric layer and directly covers the dielectric layer. The first copper foil layer is disposed on the releasing layer and directly covers the releasing layer. The nickel layer is disposed on the first copper foil layer and directly covers the first copper foil layer.