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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9281359 B1

PDFFull Text
Expired
Date of Patent:
Mar. 08, 2016

Filed:

Aug. 20, 2012

Semiconductor device comprising contact trenches

Applicants:

Markus Zundel, Egmating, DE;

Andreas Meiser, Sauerlach, DE;

Hans-peter Lang, Munich, DE;

Thorsten Meyer, Munich, DE;

Peter Irsigler, Obernberg/Inn, AT;

Inventors:

Markus Zundel, Egmating, DE;

Andreas Meiser, Sauerlach, DE;

Hans-Peter Lang, Munich, DE;

Thorsten Meyer, Munich, DE;

Peter Irsigler, Obernberg/Inn, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Lex Malsawma

Assistant Examiner:

Gardner W Swan

Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 21/74 (2006.01); H01L 29/861 (2006.01); H01L 21/8234 (2006.01); H01L 29/40 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); H01L 21/02 (2013.01); H01L 21/743 (2013.01); H01L 21/762 (2013.01); H01L 21/76224 (2013.01); H01L 21/823475 (2013.01); H01L 23/48 (2013.01); H01L 27/0694 (2013.01); H01L 29/417 (2013.01); H01L 29/41741 (2013.01); H01L 29/41766 (2013.01); H01L 29/66477 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7803 (2013.01); H01L 29/7813 (2013.01); H01L 29/7845 (2013.01); H01L 21/823418 (2013.01); H01L 29/0657 (2013.01); H01L 29/407 (2013.01); H01L 29/456 (2013.01); H01L 29/861 (2013.01); H01L 2924/0002 (2013.01);
Abstract

One embodiment of a semiconductor device includes a semiconductor body with a first side and a second side opposite to the first side. The semiconductor device further includes a first contact trench extending into the semiconductor body at the first side. The first contact trench includes a first conductive material electrically coupled to the semiconductor body adjoining the first contact trench. The semiconductor further includes a second contact trench extending into the semiconductor body at the second side. The second contact trench includes a second conductive material electrically coupled to the semiconductor body adjoining the second contact trench.

Find Patent Forward Citations

Zundel, Markus. (2016). Semiconductor device comprising contact trenches (U.S. Patent No. 9281359). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9281359

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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