The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Oct. 30, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jong-Min Baek, Suwon-si, KR;

Sang-Ho Rha, Seongnam-si, KR;

Woo-Kyung You, Suwon-si, KR;

Sang-Hoon Ahn, Goyang-si, KR;

Nae-In Lee, Seoul, KR;

Ki-Chul Kim, Seongnam-si, KR;

Jeon-Il Lee, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/7684 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01); H01L 21/76883 (2013.01); H01L 23/528 (2013.01); H01L 23/5222 (2013.01); H01L 23/53295 (2013.01); H01L 23/5329 (2013.01); H01L 23/53223 (2013.01); H01L 23/53266 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A wiring structure includes a first insulation layer, a plurality of wiring patterns, a protection layer pattern and a second insulation layer. The first insulation layer may be formed on a substrate. A plurality of wiring patterns may be formed on the first insulation layer, and each of the wiring patterns may include a metal layer pattern and a barrier layer pattern covering a sidewall and a bottom surface of the metal layer pattern. The protection layer pattern may cover a top surface of each of the wiring patterns and including a material having a high reactivity with respect to oxygen. The protection layer pattern may cover a top surface of each of the wiring patterns and including a material having a high reactivity with respect to oxygen.

Published as:
US2015179582A1; KR20150073595A; US9281277B2; US2016133577A1; KR102146705B1;

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